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- Anodic bonding technology of semiconductor silicon and glass wafer is key technology of MEMS. As one of the key materials, there is a broad industrial applied future about anodic bonding glass. 半导体硅与玻璃的静电键合技术是微电子机械系统(MEMS)的关键技术，而作为关键材料之一的静电键合玻璃有着广阔的工业应用前景。
- An effective micromachining process is developed to improve the reliability of the metal wire in the multi-sensor and to avoid adhesion between the PYREX glass and silicon mass in the process of anodic bonding. 针对芯片上各电阻间金属引线的可靠性问题和加速度传感器质量块吸附问题提出了有效的改进方法。
- In this dissertation, a Twyman-Green interferometer is used to measure silicon surface deformation after anodic bonding. 本文还采用基于相移干涉的泰曼-格林干涉测试系统对键合后硅片的形貌进行了测量。
- POMERANTZ D I. Anodic bonding[ P] , U. S. Patent , 1968(3) : 278. 卢学刚.;阳极焊工艺及结合机理研究[D]
- Keywords anodic bonding;borosilicate glass;silicon;transition area; 阳极键合;硼硅玻璃;硅;过渡区;
- Keywords anodic bonding;borosilicate glass;silicon;interfacial reaction; 关键词阳极键合;硼硅玻璃;硅;过渡区;
- To reduce the production costs and simultaneously obtain high production quality, a flexible microassembly system for automated anodic bonding of MEMS sensors is developed. 为了降低生产成本，同时提高传感器的产品质量，研制了柔性自动阳极键合系统。
- An organic-inorganic hybrid macro-porous monolith material was prepared via Sol-Gel process incorporating polymeric component of a new aromatic pore-forming agent with silicon glass. 以自行设计并合成的含苯环成孔剂为有机相,正硅酸乙酯为无机相,基于溶胶-凝胶方法,制备了有机/无机两相间以共价键结合的杂化大孔材料。
- Keywords anodic bonding;glass;silicon;aluminium;Kovar alloy;common anode; 阳极键合;玻璃;硅;铝;可伐合金;公共阳极;
- Electric Field-assisted Anodic Bonding of Glass to Kovar Alloy 玻璃与可阀合金的电场辅助阳极连接
- The glass-ceramic in Li2O-Al2O3-SiO2 system including Na2O with TiO2 and ZrO2 as nucleation agents, which was used to anodic bond in MEMS, was p roduced by the way of conventional melt quenching technology and two-step heat-t reatment. 采用传统的熔体冷却方法,研究以TiO2和ZrO2为成核剂,以含Na2O的Li2O-Al2O3-SiO2系统微晶玻璃为基础组成,通过二步法热处理制度制备出符合微电子机械系统静电键合要求的微晶玻璃材料。
- silicon glass cloth laminated sheet 硅玻璃布层压片
- Double Mobile Alkali Ion Model for Anodic Bonding 阳极连接中碱金属双离子迁移模型
- One movable alkali ion model for anodic bonding 阳极连接过程的碱金属单离子迁移模型
- Have a glass of beer to rinse your dinner down. 喝杯啤酒把你吃的晚饭冲下去。
- We supply consumables for test and assembly, as well as packaging, semiconductor fabrication related equipments such as lithography mask aligner, anodic bonder, and etc. ACCULEX 消耗品供应的芯片测试和装配，以及包装材料，半导体制造相关设备，如光刻掩模同步，阳极焊机，等你可以指望我们的晶圆制造设备（提，林研究，瓦里安，珀金埃尔默， SVG的）备件。
- He looked through a pane of glass. 他从一块玻璃看过去。
- A Possible Mechanism for Current Peak during Anodic Bonding 阳极连接电流峰的一种可能机制
- The silicon chips are less than a millimeter thick. 这些矽片厚度不足一毫米。
- The car bumped and his forehead hit the glass. 汽车颠簸了一下，他的前额撞到了玻璃上。
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