Based on the trade-off of SI, EMC, area, power and heat requirements, a double-sides , six layers laminated MCM with full metal package is presented for this 500MHz mix-signal microsystem.

• 本文将信号完整性(Signal Integrity, SI)以及电磁兼容性(Electromagnetic Compatibility, EMC)设计融入到高速MCM 的互连与封装设计中,同时兼顾组件的功耗与散热性、面积与集成度的要求。