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With 0.49% - 1.68% powder of AgI mixed in hydrolytic-polymeric reaction between Si(OC2H5)4 and C2H5OH, 0.8-9.0 mm3 serial agglomerations of Ag + conductive gel were prepared by sol-gel process.
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采用溶胶-凝胶法在正硅酸乙酯和无水乙醇的水解缩聚反应过程中;掺入质量百分比为0.;49%25-1
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