The traditional Al metallization could not meet the requirements for the development of interconnect technology. Developing damascene Cu metallization has become the main trend recently for the interconnect technology.

• 传统的Al金属互连技术已经不能满足现代互连技术发展的需要 ,大马士革结构的Cu金属互连技术已成为互连技术的重点发展方向之一。