The technological capabilities of electronic solders were presented through analysis the action of solders in the soldering process, which includes temperature of melting or solidifying, anti-oxidation capability, wetability and overflow capability.

• 摘要通过分析焊料在钎焊过程中的行为，提出了电子焊料的工艺性能主要包括熔化/固化温度、抗氧化性、润湿性和漫流性。