The process of copper metallizing of carbon powder was investigated. The hydrophilicity, sensitization, activation and reduction were also studied. The copper deposit could be made thicker by electromagnetic agitation.

• 摘要研究了在碳粉表面电镀铜的工艺。首先对碳粉表面进行亲水、敏化、活化和还原处理，然后在其表面化学镀铜，形成导电膜，再采用电磁搅拌的方法电镀铜，使镀层加厚。