The hot air system was the hold sway in the SMT re-work system,but there still have many obvious weakness of hot air system application specially in the BGA and CSP chip.

• 多年来SMT的返修系统几乎是热风系统一统天下,然而在实际使用中,尤其是在对BGA、CSP先进封装器件电路板的返修过程中,热风返修系统却暴露出很多明显的缺点。