The deadline of the legislation for lead-free,solder paste stencil printing bumping process, electroplating for wafer bumping,UBM,reliability issues and the way ahead are briefly stated in this paper.

• 本文简要叙述了无铅化立法确定的最后期限、凸点成形工艺、晶圆片凸点成形电镀技术、凸点下金属化及可靠性问题和无铅化材料的发展方向。