Most recently, they have introduced their MicroTouch feature that reduces touchdown damage that can occur when testing fragile devices or when pads are located over active circuit geometry.

• 回顾半导体产业的发展，晶圆从6英寸进化到8英寸，一直到现在的12英寸晶圆，伊智的技术发展和自动化水平也能亦步步趋，满足更加精确、速的系统。