In this paper the situation and development of electronic packaging and its requirments for the encapsulate materials in high properties were introduced and a novel kind alicyclic epoxy for electronic packaging was also reviewed with13 refs.

• 结合电子封装的现状、子塑封材料的发展以及电子封装对塑封材料提出的高性能要求,介绍了新型脂环族环氧树脂及其作为塑封材料的应用前景,其包括耐热型液体、磷三官能团型、机硅多官能团脂环族环氧树脂。