However, the solder joint reliability under thermal cycling conditions becomes a critical problem when mounting the WLP onto a PCB when the underfill layer has been eliminated.

• 然由于晶圆级构装不填注底胶，因此当晶圆级构装于组装PCB基板后承受热循环负载时，焊锡接点可靠度已成为构装结构主要可靠度问题之一。