For avoiding the disadvantage of filling the underfill and keeping good reliability, this research proposes a novel concept of no underfill with constraint layer flip chip package.

• 为避免覆晶封装结构中使用底胶填充之限制，且同时保有良好的可靠性，本文提出无底胶附加限制层覆晶封装结构的新概念。