For a high-complexity board with more than 30,000 solder joints, a test strategy of AOI, AXI and ICT before functional test may be most cost-effective.

• 对于焊点大于30000个的高复杂性印板，在功能测试之前进行AOI、AXI和ICT等测试的方案，会是成本效果最佳的。