A power consumption equation of MCM(Multi-Chip Module) interconnect is presented in an S-domain RLC transmission line model. Simulation results are shown to verify the theoretical analysis.

• 为了分析多芯片组件的互连功耗；用RLC传输线模型对多芯片组件的互连进行表征；通过对输入互连的电流及其等效电阻的近似；推导出多芯片组件互连功耗的频域数学表达式；给出计算机仿真试验结果；对方法的有效性进行验证.