封装密度

• density of packaging
• packaging density

参考释义

封装密度

• -

例句

1. 减少元件和电路的几何尺寸，以达到增加电路的封装密度、减少功耗和减小信号传播延迟的目的。
   The reduction in size of components and circuits for increasing package density and reducing power dissipation and signal propagation delays.